(window.webpackJsonp=window.webpackJsonp||[]).push([[544],{859:function(t,a,r){"use strict";r.r(a);var s=r(10),v=Object(s.a)({},(function(){var t=this,a=t._self._c;return a("ContentSlotsDistributor",{attrs:{"slot-key":t.$parent.slotKey}},[a("h1",{attrs:{id:"pcb板载集成惯性传感器"}},[a("a",{staticClass:"header-anchor",attrs:{href:"#pcb板载集成惯性传感器"}},[t._v("#")]),t._v(" PCB板载集成惯性传感器")]),t._v(" "),a("h2",{attrs:{id:"pcb-layout"}},[a("a",{staticClass:"header-anchor",attrs:{href:"#pcb-layout"}},[t._v("#")]),t._v(" PCB Layout")]),t._v(" "),a("p",[t._v("针对板载惯导传感器的集成设计，不合理的设计是失败的主要原因。 主要有以下几个注意的核心点：应力影响/温度/电源噪声/磁噪声。")]),t._v(" "),a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/1.jpg",caption:"\n"}}),t._v(" "),a("h2",{attrs:{id:"布局原则"}},[a("a",{staticClass:"header-anchor",attrs:{href:"#布局原则"}},[t._v("#")]),t._v(" 布局原则")]),t._v(" "),a("fdi-row",{attrs:{gap:"60px"}},[a("p",[t._v("● PCB中机械应力小的地方 "),a("br"),t._v("\n● 注意PCB外形引起的安装压力 "),a("br"),t._v("\n● 远离微控制器和大功率器件 "),a("br"),t._v("\n● 芯片区域远离via"),a("br"),t._v("\n● 不要上胶"),a("br"),t._v("\n● 远离按键、连接器、屏蔽罩")]),t._v(" "),a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/3.png",caption:"\n"}})],1),t._v(" "),a("h2",{attrs:{id:"机械应力和热应力"}},[a("a",{staticClass:"header-anchor",attrs:{href:"#机械应力和热应力"}},[t._v("#")]),t._v(" 机械应力和热应力")]),t._v(" "),a("fdi-row",{attrs:{gap:"60px"}},[a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/31.png",caption:"\n"}}),t._v(" "),a("p",[t._v("● 注意PCB外形引起的安装压力 "),a("br"),t._v("\n● 远离微控制器和大功率器件 "),a("br"),t._v("\n● 焊接NC"),a("br"),t._v("\n● 芯片底部 不要布线"),a("br"),t._v("\n● 注意安装压力"),a("br"),t._v("\n● 不要上胶"),a("br"),t._v("\n● 远离按键、连接器、屏蔽罩")])],1),t._v(" "),a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/2.jpg",caption:"\n真空防静电铝箔包装带有干燥剂防潮色卡 BGA 10*10  240piece/盘"}}),t._v(" "),a("h2",{attrs:{id:"smt-制造"}},[a("a",{staticClass:"header-anchor",attrs:{href:"#smt-制造"}},[t._v("#")]),t._v(" SMT 制造")]),t._v(" "),a("ul",[a("li",[t._v("采用回流焊，避免手焊")]),t._v(" "),a("li",[t._v("采用塑料/橡胶吸嘴")]),t._v(" "),a("li",[t._v("避免撞击")]),t._v(" "),a("li",[t._v("设置合理的温度范围")]),t._v(" "),a("li",[t._v("小心跌落/小心振动")]),t._v(" "),a("li",[t._v("使用前保存在真空包内")])]),t._v(" "),a("fdi-row",{attrs:{gap:"20px"}},[a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/32.png"}}),t._v(" "),a("fdi-img",{attrs:{alt:"MEMS",src:"/knowledge-base/03/pcblayout/33.png"}})],1),t._v(" "),a("cite-panel",{attrs:{type:"warning",title:"警告！！！"}},[a("p",[t._v("SMT前禁止拆开真空包装过长时间暴露在湿度较大的空气中，水凝珠会导致smt过程中损坏模组内部导致损坏。请在smt前按照操作规范进行烘烤。")])]),t._v(" "),a("ul",[a("li",[t._v("不要手工分板")]),t._v(" "),a("li",[t._v("不要超声波清洗")]),t._v(" "),a("li",[t._v("不要在存储中打开真空包")]),t._v(" "),a("li",[t._v("跌落过的芯片不能使用")]),t._v(" "),a("li",[t._v("远离机械、电磁、温度干扰")])])],1)}),[],!1,null,null,null);a.default=v.exports}}]);