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"),e("h3",{attrs:{id:"v-a-n-pw版本-gh1-25排线版本"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#v-a-n-pw版本-gh1-25排线版本"}},[t._v("#")]),t._v(" V/A/N -pw版本 GH1.25排线版本")]),t._v(" "),e("fdi-img",{attrs:{width:"80%",alt:"MEMS",src:"/deta/UserManuals/规格/10/gh7p版本.png",caption:""}}),t._v(" "),e("hr"),t._v(" "),e("hr"),t._v(" "),e("h2",{attrs:{id:"电气性能和可靠性"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#电气性能和可靠性"}},[t._v("#")]),t._v(" 电气性能和可靠性")]),t._v(" "),e("table",[e("thead",[e("tr",[e("th",{staticStyle:{"text-align":"left"}},[e("strong",[t._v("绝对最大值")])]),t._v(" "),e("th",{staticStyle:{"text-align":"left"}}),t._v(" "),e("th"),t._v(" "),e("th")])]),t._v(" "),e("tbody",[e("tr",[e("td",{staticStyle:{"text-align":"left"}},[e("strong",[t._v("参数")])]),t._v(" "),e("td",{staticStyle:{"text-align":"left"}},[e("strong",[t._v("最小")])]),t._v(" "),e("td",[e("strong",[t._v("最大")])]),t._v(" "),e("td",[e("strong",[t._v("单位")])])]),t._v(" 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的情况下，模块可在真空密封袋中存放 12 个月。")]),t._v(" "),e("p",[t._v("2.当真空密封袋打开后，若满足以下条件，模块可直接进行回流焊或其它高温流程：")]),t._v(" "),e("p",[t._v("模块存储空气湿度小于 10%。")]),t._v(" "),e("p",[t._v("模块环境温度低于 30 摄氏度，空气湿度小于 60%，工厂在 72 小时以内完成贴片。")]),t._v(" "),e("p",[t._v("3.若模块处于如下条件，需要在贴片前进行烘烤：")]),t._v(" "),e("p",[t._v("当环境温度为 23 摄氏度（允许上下 5 摄氏度的波动）时，湿度指示卡显示湿度大于 10%。")]),t._v(" "),e("p",[t._v("当真空密封袋打开后，模块环境温度低于 30 摄氏度，空气湿度小于 60%，但工厂未能在 72小时以内完成贴片。")]),t._v(" "),e("p",[t._v("当真空密封袋打开后，模块存储空气湿度大于 10%。")]),t._v(" "),e("p",[t._v("4.如果模块需要烘烤，请在 125 摄氏度下（允许上下 5 摄氏度的波动）烘烤 48 小时。")]),t._v(" "),e("cite-panel",{attrs:{title:"备注："}},[e("p",[t._v("模块的包装无法承受高温烘烤。因此在模块烘烤之前，请移除模块包装。如果只需要短时间的烘烤，请参考IPC/JEDECJ-STD-033 规范。")])]),t._v(" "),e("h2",{attrs:{id:"生产焊接"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#生产焊接"}},[t._v("#")]),t._v(" 生产焊接")]),t._v(" "),e("p",[t._v("用印刷刮板在网板上印刷锡膏，使锡膏通过网板开口漏印到 PCB 上，印刷刮板力度需调整合适。为保证模块印膏质量，模块焊盘部分对应的钢网厚度推荐为 0.18mm。详细信息请参考设计文档。")]),t._v(" "),e("p",[t._v("推荐的回流焊温度为 235~245ºC，最高不能超过 260ºC。为避免模块因反复受热而损坏，建议客户在完成 PCB 板第一面的回流焊之后再贴模块。保证模组朝上放置，推荐的炉温曲线图如下所示：")]),t._v(" "),e("fdi-img",{attrs:{width:"60%",alt:"MEMS",src:"/deta/UserManuals/规格/10/图片1.png",caption:""}}),t._v(" "),e("h2",{attrs:{id:"包装"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#包装"}},[t._v("#")]),t._v(" 包装")]),t._v(" "),e("h2",{attrs:{id:"传感器校准"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#传感器校准"}},[t._v("#")]),t._v(" 传感器校准")]),t._v(" "),e("p",[t._v("FDIsystems 对 DETA系列 在整个工作温度范围和三个传感器范围内的偏置、灵敏度、错位、跨轴灵敏度、非线性和陀螺仪线性加速度灵敏度进行了校准。请保证传感器在正常工作温度和冲击范围内使用，防止因外力造成模块的工作特性改变，导致校准参数失效。DETA40内置了多种在线校准算法，包含IMU 零偏刻度因子以及温度相关参数的自动自动化校准功能，以及磁力计的2D 和3D 软硬磁补偿，还提供了里程计、GNSS双天线安装校准等，具体请参考相关的教程。")]),t._v(" "),e("h2",{attrs:{id:"bootloader和sn"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#bootloader和sn"}},[t._v("#")]),t._v(" Bootloader和SN")]),t._v(" "),e("p",[t._v("每一个 DETA40系列芯片模组拥有各自唯一的ID序列SN号，可以模组通过预置Bootloader识别ID 和完成固件的升级等操作，FDIsystems 保留了每一个模组校准后的校准参数文档和固件，如果需要的话，您可以联系我们获得DETA系列 模组的校准参数文档；固件一般是不提供的，仅在DETA系列 模组因操作不当或硬件损坏导致无法启动时，您可以返厂给我们，我们在修复模组后，通过其唯一的芯片ID序列找到对应的固件进行重新烧录。")]),t._v(" "),e("h2",{attrs:{id:"资源下载"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#资源下载"}},[t._v("#")]),t._v(" 资源下载")]),t._v(" "),e("h2",{attrs:{id:"硬件设计资料"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#硬件设计资料"}},[t._v("#")]),t._v(" 硬件设计资料")]),t._v(" "),e("h3",{attrs:{id:"deta10-20-30-40p系列-box版本电气"}},[e("a",{staticClass:"header-anchor",attrs:{href:"#deta10-20-30-40p系列-box版本电气"}},[t._v("#")]),t._v(" DETA10/20/30/40P系列 box版本电气")]),t._v(" "),e("p",[t._v("集成设计参考\n共有以下2种型号：")]),t._v(" "),e("table",[e("thead",[e("tr",[e("th",{staticStyle:{"text-align":"center"}},[t._v("型号")]),t._v(" "),e("th",{staticStyle:{"text-align":"center"}},[t._v("外形")]),t._v(" "),e("th",[t._v("STEP")])])]),t._v(" "),e("tbody",[e("tr",[e("td",{staticStyle:{"text-align":"center"}},[t._v("DETA10/20/30/40P系列fpc图纸")]),t._v(" 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